When the speed of a certain loading event is too fast for the human eye to capture, high-speed imaging can be an extremely valuable analyzing tool. It allows for digitally recording short-time events occurring in a few milliseconds or fast-moving objects that cannot be viewed or analyzed in real-time. These images can be rendered to a digital video, giving greater insight into the actual behavior, and this by slowing down the video frame rate to a speed that allows for visual analysis.
High-speed imaging is frequently used in material characterization to analyze the physical and/or mechanical properties of various materials and components. For example, when dropping a mass or object from a certain height onto a product, high-speed images are used to perform impact energy studies and analyze first failure points together with overall structural integrity.
During service life, materials and products can be subjected to short-term dynamic loads. Some of these loading events could be predefined, while others happen accidentally. It is important that the design of a new product accounts for these dynamic loads, meaning that often dynamic experimental tests are necessary during the design or validation phase.
In addition to the qualitative visual monitoring of the test, more quantitative data acquisition can be set up by synchronizing a high-speed DAQ system (HBM Genesis SI) with high-speed cameras and external data signals (force, torque, strain gauges). The images taken during the dynamic loading event can also be used in combination with full-field Digital Image Correlation. Material designers and product engineers can use both qualitative and quantitative data sets to correlate and calibrate finite element material and structural models.
Besides material characterization and model calibration, high-speed imaging can also play a role in analyzing manufacturing and production processes, machinery kinetics, and dynamics.
TECHSPERT utilizes PHOTRON high-speed imaging technology capable of capturing up to 500,000 images per second, together with HBM Genesis SI data acquisition systems that can record data from 20 kHz up to 100 MHz.
Drop weight impact test combined with in-situ high-speed camera monitoring of the top and bottom surface.
Measurement of edgewise impact failure point of silicon wafer material.
Composite winded tubes are crushed to analyze the energy absorption properties of materials. In-situ high speed camera monitorring records the full failure crushing event of the tubes and can be linked to synchronized load, displacement, speed and acceleration data.
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